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Tabletop bonding device Product List

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Desktop Adhesive Device for Robotics: 'Lamico'

Contributes to the stabilization of sensor placement quality. Ensures stable adhesive quality for everyone.

In the field of robotics, particularly in sensor placement, precise and uniform adhesion directly impacts the performance and reliability of the product. Manual application and jig application, which depend on the skill level of the operator, are prone to air bubble inclusion and quality variation, potentially leading to sensor malfunctions or failures. To address these challenges and achieve stable sensor placement, our tabletop bonding device 'Lamico' has been developed. [Usage Scenarios] - Mounting sensors on robotic arms - Bonding sensors for autonomous driving systems - Precise placement of sensors for inspection devices [Benefits of Implementation] - Stabilization of quality in the sensor placement process - Reduction of defects due to air bubble inclusion - Decrease in quality variation caused by operators

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Tabletop Laminating Device 'Lamico' for Insulation Material Bonding【For Building Materials】

Stabilize the insulation material bonding process. Achieve uniform quality for everyone.

In the building materials industry, particularly in the manufacturing of insulation materials, there is a demand for uniformity in adhesive quality between components and the prevention of performance degradation due to air bubble inclusion during construction. To maximize the performance of insulation materials, consistent quality control from adhesive application to bonding is crucial. Traditional methods that rely on manual labor or jigs tend to depend heavily on the skill level of the workers, leading to issues such as quality variation and air bubble inclusion. Our tabletop bonding device, 'Lamico,' addresses these challenges by providing stable adhesive quality that is not influenced by the skill of the operator, contributing to the standardization of processes and reduction of defects. 【Application Scenarios】 - Layering and bonding of insulation materials - Temporary fixing and final bonding of building material panels - Production of small quantities of various building material prototypes - Sample bonding in quality evaluation processes 【Benefits of Implementation】 - Improved product reliability through stabilization of adhesive quality - Mitigation of insulation performance degradation due to air bubble inclusion - Reduction of quality variation caused by operators - Decrease in defective products and improvement in yield - Enhanced production efficiency through process standardization

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Desktop Bonding Device for Semiconductors 'Lamico'

Contributes to the stabilization of the wafer protection process. Quality improvement through bubble-free bonding.

In the semiconductor industry, particularly in the wafer protection process, the inclusion of fine bubbles can affect product reliability. Manual application and jig application, which depend on the skill level of the operator, carry risks of quality variation and reduced yield. In response to these challenges, our tabletop bonding device 'Lamico' consistently controls the process from adhesive application to bonding, achieving stable bonding with reduced bubbles even with transparent adhesives. 【Usage Scenarios】 - Bonding of wafer protective films - Evaluation of small quantities of various prototypes - Processes requiring precise bonding 【Benefits of Implementation】 - Reduction of quality variation caused by operators - Decrease in defects due to bubble inclusion - Standardization of processes and improvement of yield \For more details, please contact us or view the PDF materials available for download in the catalog./

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Tabletop Laminating Device 'Lamico' for Automotive Interior Parts

Stabilizing the bonding process of automotive interior components. Achieving high-quality finishes that anyone can accomplish.

In the automotive industry's interior parts manufacturing, high quality standards and uniform finishes are required. Particularly in the bonding of visible parts, the inclusion of air bubbles and variations in quality can affect the product's appearance and durability. Manual bonding and jig bonding, which depend on the skill level of the operator, are prone to these issues, potentially leading to the occurrence of defective products and reduced yield. Our tabletop bonding device, 'Lamico,' was developed to address these challenges. 【Usage Scenarios】 - Bonding films or surface materials to interior panels - Prototype production in small-batch, diverse production - Stable bonding in quality evaluation processes 【Benefits of Implementation】 - Achieving uniform adhesive quality with fewer air bubbles - Reducing quality differences caused by operators - Decreasing defects and improving yield - Enhancing productivity through process standardization

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Desktop Laminating Device 'Lamico' for the Printing Industry

Stable adhesive quality for special processing of printed materials.

In the printing industry, precise lamination is required to achieve a balance between the beauty and durability of the finished product, especially when adhering to transparent films or special materials. The inclusion of air bubbles and variations in quality can undermine the value of the product. Manual lamination or jig-based lamination, which relies on the skill level of the operator, tends to encounter these challenges, making it difficult to standardize the process. Our tabletop lamination device, 'Lamico,' consistently controls everything from adhesive application to lamination, achieving stable lamination with reduced air bubbles even with transparent adhesives, thus solving these issues. 【Usage Scenarios】 - Lamination of special processing films - Laminating high-quality printed materials - Prototype and small lot production 【Benefits of Implementation】 - Reduces quality variations caused by operators - Decreases defects due to air bubble inclusion - Standardizes processes and improves yield

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